Integration ecosystem

Connected across algorithms, frameworks, and silicon.

Technical collaboration across the audio ecosystem helps EaseAudio integrate its algorithms into practical platform architectures and production systems.

01

DSP Concepts

EaseAudio supports Audio Weaver design, module development, integration, training, and technical support for automotive and embedded products.

  • Audio Weaver system design
  • Custom AWE modules
  • Training and technical support
02

Qualcomm

We co-develop AudioReach and AWE-Q solutions across Snapdragon Automotive and consumer platforms, including multi-core ARM and DSP deployment.

  • SA8295P, SA8255P, SA8775P, SA8797P, SA8155P
  • ARM, ADSP, GPDSP0, and GPDSP1
  • QCC5181, Snapdragon S7 (QCC7228), QCS405, QCS8250, QCS605, XR2130, etc.
03

Cadence

EaseAudio brings up, ports, and optimizes audio systems for Cadence HiFi DSPs across a broad range of embedded silicon partners.

  • HiFi3, HiFi4, and HiFi5
  • Single, dual, and multi-core
  • SiEngine, AKM, NXP, Amlogic, Syntiant, Airoha

Confidential, collaborative, production-focused.

We work alongside product, silicon, acoustic, and software teams across regions while protecting the details that make each customer's product unique.

Build the complete audio path.

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